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Keywords: heat sink
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Journal Articles
Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
Published Online: May 19, 2022
... the efficiency and reliability of these devices, the high amount of heat that they generate must be properly removed. In this paper, a three-dimensional numerical model has been developed and experimentally validated for several manifold heat sink designs. The goal was to enhance the heat sink's thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011006.
Paper No: EP-19-1100
Published Online: June 4, 2020
...Yongtong Li; Liang Gong; Minghai Xu; Yogendra Joshi In this paper, a concept of metal foam heat sink with pin fins (MFPF heat sink) is proposed to improve the cooling performance of high-powered electronics with nonuniform heat flux. Numerical simulations are carried out to investigate...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021001.
Paper No: EP-18-1068
Published Online: February 25, 2019
...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011004.
Paper No: EP-13-1140
Published Online: October 6, 2014
... Clearance on Turbulent Heat Transfer From a Shrouded, Longitudinal Fin Array ,” ASME J. Heat Transfer , 108 ( 3 ), pp. 519 – 524 . 10.1115/1.3246965 [4] Wirtz , R. A. , Chen , W. , and Zhou , R. , 1994 , “ Effects of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
Published Online: April 29, 2014
.... Editor: Gongnan Xie. 24 07 2013 26 03 2014 A model of mini heat sink with microchannels was developed to obtain homogeneous heat transfer capability. The channels are constructed in the form of eight triangular arrays based on a square substrate. Air is sucked from the periphery...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011002.
Paper No: EP-13-1047
Published Online: November 22, 2013
...Kyoung Joon Kim In this study, we have proposed a hybrid fin heat sink (HFH) composed of the array of hybrid fins (HFs). The HF is a hollow pin fin integrated with plate fins. The CFD model was developed to predict the thermal performance of the HFH, and the model was used to investigate...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041005.
Published Online: October 30, 2012
... that need to be addressed before they can be successfully implemented in heat sink design. The interface between the device and heat sink is an important factor in the thermal design of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... strategies in data centers. Finally, the impact of heat sink thermal resistance is considered, and the potential data center efficiency gains from improved heat sink designs are discussed. 07 04 2011 09 05 2011 21 09 2011 21 09 2011 computer centres cooling fans heat sinks...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031004.
Published Online: June 23, 2009
... areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
..., the disagreements are not due to omitting the fluid conduction in the current analysis. Comparison to Lee and Vafai ( 8 ) for κ = 0.01 and various Bi 21 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams convection heat sink metal...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021008.
Published Online: April 2, 2009
...T. L. Bergman Heat transfer enhancement associated with use of a nanofluid coolant is analyzed for small electronic heat sinks. The analysis is based on the ε -NTU heat exchanger methodology, and is used to examine enhancement associated with use of H 2 O – Al 2 O 3 nanofluids in a heat sink...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 190–194.
Published Online: July 6, 2006
...Zhipeng Duan; Y. S. Muzychka The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on developing laminar flow in rectangular channels is proposed. The model...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 412–418.
Published Online: November 23, 2005
...Zhipeng Duan; Y. S. Muzychka Impingement cooling of plate fin heat sinks is examined. Experimental measurements of thermal performance were performed with four heat sinks of various impingement inlet widths, fin spacings, fin heights, and airflow velocities. The percent uncertainty in the measured...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 53–60.
Published Online: July 30, 2005
...M. Baris Dogruoz; Alfonso Ortega; Russell V. Westphal A model for the pressure drop and heat transfer behavior of heat sinks with top bypass is presented. In addition to the characteristics of a traditional two-branch bypass model, the physics of tip leakage are taken into consideration. The total...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 82–91.
Published Online: June 4, 2005
...Ta-Wei Lin; Ming-Chang Wu; Li-Kang Liu; Chun-Jen Fang; Ying-Huei Hung A series of experimental investigations on the studies related to transient- and steady-state cooling performance from the horizontally heated heat sinks with a confined slot jet impingement have been conducted. The relevant...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
...Han-Ting Chen; Jenn-Tsong Horng; Po-Li Chen; Ying-Huei Hung An effective method for predicting and optimizing the thermal performance of heat sinks with Parallel-Plain Fin under a given design constraint of pressure drop has been successfully developed in the study. The thermal and hydrodynamic...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
Published Online: June 10, 2003
... best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints...