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Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
... is a convenient solution for wide band and high gain millimeter wave AiP system integration. 1 Corresponding author. e-mail:  zhangxs15@mails.tsinghua.edu.cn e-mail:  wang-qian@mail.tsinghua.edu.cn e-mail:  smartxvip@163.com e-mail:  1285769573@qq.com e-mail:  wanggang_cetc@126.com e...
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides