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Keywords: image processing
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021010.
Paper No: EP-23-1059
Published Online: December 11, 2023
... opening Image preprocessing of solder balls: (a) original image, (b) median filtered image, (c) binarized image, and (d) image after opening Fig. 1 Solder ball inspection system: ( a ) schematic diagram of image acquisition device, ( b ) schematic diagram of image processing, ( c ) profile...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
Published Online: October 5, 2023
... due to the high resolution to byte, thereby allowing for faster image processing, which is required in real-time applications. Most of the current solutions for improving sensor vision in autonomous vehicles aim to prevent obstruction on the sensor lenses through the use of passive hydrophobic...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
Published Online: February 22, 2021
... on the chip. Four distinct image processing algorithms are evaluated and compared in terms of speed, accuracy, and occurrence of false positives and negatives. The impact of background thermal activity and finite duration of Trojan activity on the accuracy of detection is investigated. Within the parameter...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
Published Online: December 12, 2002
.... , and Asundi , A. , 2001 , “ Thermal deformation measurement of electronic packages using the atomic force microscope scanning moire technique ,” Rev. Sci. Instrum. , 72 , No. 4 , pp. 2180 – 2185 . Wiese, S., Rossek, U., Feustel, F., and Meusel, E., 1997, “Image Processing Analysis in Micropackaging...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain measurement thermal stresses thermal expansion integrated circuit reliability image processing One...