1-5 of 5
Keywords: impact testing
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... their lifespan and the product is required to survive common drop accidents. A widely accepted method to assess the drop reliability of microelectronics on board-level is the drop impact test. This test has been standardized by international councils such as Joint Electron Device Engineering Council...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 98–104.
Published Online: April 18, 2006
...Chang-Lin Yeh; Yi-Shao Lai The ball impact test is developed as a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. Following classical structural dynamics principles...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 496–502.
Published Online: March 30, 2005
... the modulus of the interconnection materials, reducing the span of the PCB, or using either a very thin or a very thick PCB. 05 11 2004 30 03 2005 impact testing printed circuit testing stress-strain relations reliability electronic packaging drop impact finite element parametric...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... carried out using a scanning electron microscope revealed that the interface between the ICA and copper pad on the PCB was the weakest region of the joint. The split Hopkinson bar (Kolsky 2 ) has been developed as equipment for high-energy impact tests. In the present work, the Hopkinson bar...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 surface mount technology printed circuit testing bending impact testing impact strength adhesives shear strength interconnections circuit reliability scanning...