... findings. For 90 V RMS driving voltage, the discrepancies were found to be higher, being 31% at 8 mm spacing and 44% at 24 mm spacing. 11 10 2004 20 04 2005 jets cooling boundary layer turbulence forced convection thermal management (packaging) infrared imaging...

... multichip modules natural convection finite element analysis infrared imaging heat conduction heat transfer Three-Dimensional (3-D) packaging of multiple chips modules, the so-called vertical (or stacked) MCM packaging technologies, provides a very engaging packaging option, as compared...

... . Manuscript received October 2003. Associate Editor: B. Sammakia. 01 October 2003 30 04 2004 heat transfer printed circuits electronics packaging infrared imaging temperature distribution flow measurement temperature measurement cooling All successful electronic systems...