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Keywords: infrared imaging
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
Published Online: April 20, 2005
... findings. For 90 V RMS driving voltage, the discrepancies were found to be higher, being 31% at 8 mm spacing and 44% at 24 mm spacing. 11 10 2004 20 04 2005 jets cooling boundary layer turbulence forced convection thermal management (packaging) infrared imaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
Published Online: October 6, 2004
... multichip modules natural convection finite element analysis infrared imaging heat conduction heat transfer Three-Dimensional (3-D) packaging of multiple chips modules, the so-called vertical (or stacked) MCM packaging technologies, provides a very engaging packaging option, as compared...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 124–134.
Published Online: April 30, 2004
... . Manuscript received October 2003. Associate Editor: B. Sammakia. 01 October 2003 30 04 2004 heat transfer printed circuits electronics packaging infrared imaging temperature distribution flow measurement temperature measurement cooling All successful electronic systems...