... finite element analysis high-speed techniques image sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop...

... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling 2008 American Society of Mechanical Engineers ...

... integrated circuit packaging integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method As the integrated circuit (IC) functions develop toward more lead counts, high efficiency and high...

...-8086 , 21 , pp. 112 – 119 . 14 07 2004 03 11 2004 plastic packaging integrated circuit packaging transfer moulding encapsulation polymers integrated circuit modelling Wire Density Effect Wire Sweep Mold-Filling Analysis Transfer Molding Plastic Packaging of ICs...

... integrated circuit modelling integrated circuit reliability integrated circuit testing finite element analysis indentation viscoelasticity dielectric materials polymer films thin film circuits 21 06 2004 12 08 2004 Nanoindentation experiments were carried out on a SiLK film...

... of the vapor pressure induced expanison on the material’s deformation is discussed. 22 06 2004 26 06 2004 electronics packaging micromechanics deformation encapsulation vapour pressure integrated circuit modelling Polymer materials have wide applications in microelectronic...

... , Kluwer. Vandevelde, B., Beyne, E., Zhang, G. Q., and Caers, Jo, 2001, “Parametrized Modeling of Thermo-Mechanical Reliability,” in Proceedings of the 2nd Eurosime Conference , April 2001, Paris, France, pp. 49–54. integrated circuit reliability chip scale packaging integrated circuit...

... packaging soldering fatigue integrated circuit reliability integrated circuit modelling 01 November 2002 15 12 2003 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2002. Associate...

... gallium arsenide power amplifiers radiofrequency amplifiers MESFET integrated circuits field effect analogue integrated circuits integrated circuit packaging high-temperature electronics lead bonding thermal resistance thermal conductivity integrated circuit modelling integrated circuit...

... (packaging) integrated circuit packaging jets heat transfer pulsatile flow thermal analysis integrated circuit modelling cooling numerical analysis Jet impingement cooling of chips is an attractive option due to the high heat transfer rates associated with liquid impingement on a surface...

... thermal expansion integrated circuit modelling finite element analysis plastic packaging optical fibre theory thermal stress cracking It has been shown 40 41 that thermally induced elastic stresses in sufficiently large assemblies do not increase with a further increase in the assembly size...

... Editor: S. M. Heinrich. 26 07 2002 integrated circuit reliability ball grid arrays reflow soldering thermal stress cracking plastic packaging integrated circuit modelling integrated circuit packaging Reliability is one of the major concerns for ball grid array (BGA...

... integrated circuit packaging ball grid arrays integrated circuit modelling life testing integrated circuit testing viscoplasticity stress analysis reflow soldering Rayleigh-Ritz methods failure analysis finite element analysis Recent years have witnessed an increased use of high-I/O area...

...Marta Rencz ,, Guest Editor; Clemens Lasance ,, Guest Editor integrated circuit packaging micromechanical devices integrated circuit modelling thermal management (packaging) Microelectronics thermal experts from four continents gathered in the fall of 2000 at the Sixth Therminic...

... Structure copper integrated circuit interconnections thermal stresses stress relaxation interface phenomena failure analysis finite element analysis integrated circuit modelling diffusion barriers 2002 ASME ...

... integrated circuit modelling Creating validated thermal models of electronic packages has always been a challenge in the electronics industry. Existing metrics such as junction-to-case thermal resistance and junction-to-ambient thermal resistance are sometimes useful as figures of merit, but have...

... simulation of the three-dimensional flow and temperature field for square pin fins (256 pins) was performed by Sathe et al. 3 . heat sinks integrated circuit packaging cooling thermal resistance flow visualisation integrated circuit modelling 03 August 1998 15 February 2000...

... received by the EEPD June 10, 1998; revised manuscript received December 11, 1998. Associate Technical Editor: B. Michel. 10 June 1998 11 December 1998 integrated circuit modelling stress analysis finite element analysis The purpose of these notes is to encourage a dialogue...