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Keywords: interfacial delamination
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Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
Published Online: April 30, 2004
... analysis J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation Flip chip on broad (FCOB) is being increasingly used for a wide range of applications such as computers, portable electronics and automotive application. The FCOB provides shorter...