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Keywords: interfacial shearing stress
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041014.
Published Online: December 21, 2011
... 2011 adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer...
