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Keywords: internal stresses
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
Published Online: May 8, 2008
... force were multiplied by the corresponding factor of the number of particles. 17 01 2006 09 09 2007 08 05 2008 adhesive bonding anisotropic media conductive adhesives contact resistance delamination elastic moduli integrated circuit packaging internal stresses resins...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 96–105.
Published Online: June 3, 2005
... circuit packaging integrated circuit reliability integrated circuit interconnections printed circuits solders thermal stress cracking Weibull distribution life testing creep internal stresses The reliability of solder joints of a particular package on a printed circuit board (PCB...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... packaging micromechanical devices optical fibre couplers internal stresses coupled mode analysis optical fibre losses finite element analysis micro-optics The increasing demands for miniaturization, high electrical performance, and high input/output (I/O) pin count have led significant...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
.... , Okube , M. , and Matsumoto , T. , 1986 , “ Internal Stress of Epoxy Resin Modified With Acrylic Core-Shell Particles Prepared by Seeded Emulsion Polymerization ,” J. Appl. Polym. Sci. , 32 , pp. 4865 – 4871 . 2005 ASME ...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 351–358.
Published Online: October 6, 2004
... Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003; final revision, Jan. 2004. Associate Editor: W. King. 01 July 2003 01 Jan 2004 06 10 2004 flip-chip devices thermomechanical treatment bending internal stresses thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 301–307.
Published Online: October 6, 2004
... thin films fracture toughness internal stresses delamination surface cracks adhesion silicon elemental semiconductors semiconductor-metal boundaries fracture toughness testing Knowledge of the mode mix dependent interfacial fracture toughness (Γ) is necessary to predict if delamination...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2005, 127(2): 189–192.
Published Online: May 4, 2004
... , J. J. , 1983 , “ The Quality of Die-Attachment and Its Relationship to Stresses and Vertical Die-Cracking ,” Proc. 33rd ECC, CHMT, IEEE , New York, pp. 237 – 244 . 03 09 2003 04 05 2004 fracture toughness testing integrated circuit packaging internal stresses finite...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 142–147.
Published Online: April 30, 2004
... . Manuscript received April 2003; final revision, November 2003. Associate Editor: B. Courtois. 01 April 2003 01 November 2003 30 04 2004 glass ceramics microcracks thermal shock bending fracture internal stresses thermal analysis laser beam applications High quality...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
... Cracking in Flip Chip Packages with Viscoplastic Solder Deformation” M. S. Thesis, Lehigh University, Bethlehem, PA. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses Solder joint integrity is recognized as a key issue...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 506–511.
Published Online: December 15, 2003
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received November 2001. Associate Editor: L. Ernst. 01 November 2001 15 12 2003 internal stresses ceramic capacitors reliability finite element analysis...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... in the modeling. integrated circuit packaging moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity McSkimin , H. J. , and Andreatch , P. , 1964 , “ Elastic Moduli of Silicon vs Hydrostatic Pressure at 25.0C and −195.8C ,” J. Appl...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
Published Online: December 15, 2003
... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Feb. 2003. Associate Editor: E. Suhir. 01 Feb 2003 15 12 2003 optoelectronic devices glass stress analysis boundary-value problems packaging birefringence thermal expansion internal stresses thermal stresses In most...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
... packaging metallisation thermal conductivity finite element analysis stress analysis thermal expansion substrates modelling internal stresses Semiconductor laser diodes are the primary components of various optoelectronic applications. Unlike the ordinary semiconductors, a laser...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 400–413.
Published Online: September 17, 2003
.... dissertation, Georgia Institute of Technology, Atlanta, GA. Timoshenko, S. P., and Goodier, J. N., 1978, Theory of Elasticity , McGraw-Hill, New York, NY. internal stresses fracture encapsulation flip-chip devices packaging delamination 01 Sep 2002 17 09 2003 The flip...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 4–17.
Published Online: March 14, 2003
... thermal expansion internal stresses The foundation of microelectromechanical systems (MEMS) is the capability of creating controllable and movable mechanical structures using integrated circuit (IC) processing technology. MEMS technology has developed gradually over the last five decades...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 340–344.
Published Online: December 12, 2002
.... Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient of thermal expansion (CTE) mismatch between...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
Published Online: July 26, 2002
.... Associate Editor: S. M. Heinrich. 19 October 2000 26 07 2002 polymer films stress relaxation viscoelasticity bending internal stresses plastic packaging Damage Accumulation Residual Stress Relaxation Threshold Activation Energy Elastic Potential Polymer Film Radius...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 91–96.
Published Online: May 2, 2002
... on the combination of grain boundary sliding and matrix dislocation deformation mechanisms in order to describe a thermo-mechanical behavior of eutectic solders. Internal stress tensors are also introduced to describe the transient behaviors during the tensile test and first stage creep. A series of tensile, creep...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 115–121.
Published Online: May 2, 2002
... extracted at various wafer sites so that both normal and shear stress on the test chips can be measured. Finally, we packaged the test chips into 100-pin PQFP structures with different batches and measured internal stresses on the test chips inside the packaging. After measuring packaging induced stresses...