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Keywords: laminar flow
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. December 2012, 134(4): 041004.
Published Online: September 4, 2012
... o dependence upon Re, H/B, and B. confined impinging slot jet milliscale jet flows fully developed velocity profile laminar flow uniform heat flux Nusselt number As miniaturization and power requirements continue to progress, millimeter-scale and microscale electronic circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031006.
Published Online: September 14, 2011
... is maximized by keeping the highest temperature within the components below the allowable limit. A significant number of earlier studies have been devoted on searching for optimal spacing of infinite parallel plates and optimal arrangement of cooling passages of electronic equipment for laminar flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
... cooling copper electronics packaging laminar flow nanofluidics natural convection neural nets two-phase flow There has been a significant growth in the use of nanofluids in various industrial applications due to their enhanced thermophysical properties. Wong and De Leon ( 1 ) presented...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
Published Online: April 3, 2009
... drops laminar flow microfluidics two-phase flow Two-phase micropin-fin heat sinks that utilize arrays of microsize pin-fin as internal heat transfer enhancement structures and capitalize on latent heat exchange associated with liquid flow boiling have recently emerged as a promising...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
.... Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
...Manu Mital; Elaine P. Scott This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging of electronic components in a small and compact volume makes thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 190–194.
Published Online: July 6, 2006
...Zhipeng Duan; Y. S. Muzychka The performance of impingement air cooled plate fin heat sinks differs significantly from that of parallel flow plate fin heat sinks. A simple impingement flow pressure drop model based on developing laminar flow in rectangular channels is proposed. The model...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 157–166.
Published Online: July 3, 2006
... cooling channel flow heat transfer laminar flow integrated circuit packaging heat transfer channel flow dimple numerical model microelectronic cooling Spherical wells, shallow indentations, or dimples, are known to play a key role in the development of the fluid flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
...X. J. Wei; Y. K. Joshi; P. M. Ligrani Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50 × 10 − 6 m ( 50 μ m ) deep and 200 × 10 − 6 m ( 200 μ m ) wide. The dimples are placed in a single row along...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 412–418.
Published Online: November 23, 2005
... thermal resistance was a maximum of 2.6% in the validation tests. Using a simple thermal resistance model based on developing laminar flow in rectangular channels, the actual mean heat transfer coefficients are obtained in order to develop a simple heat transfer model for the impingement plate fin heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 157–165.
Published Online: September 28, 2005
... range of enclosure geometries and flow conditions. The model is shown to be in good agreement, to within 10% RMS, with the numerical data for all test configurations. 10 11 2004 28 09 2005 printed circuits electronics packaging natural convection boundary layers laminar flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 273–280.
Published Online: September 20, 2005
... 06 2005 20 09 2005 heat sinks laminar flow heat transfer constructal theory constructal network loops complexity temperature Heat sinks incorporating microchannels, introduced by Tuckerman and Pease ( 1 ), are an attractive design option which increases the convective...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 1–9.
Published Online: August 10, 2005
... predicts liquid flow in micro-channels, and is therefore a powerful tool for the design and analysis of micro-channel heat sinks intended for electronic cooling. 18 06 2004 10 08 2005 Navier-Stokes equations flow measurement microchannel flow laminar flow vortices cooling pressure...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
.... Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount technology Advances in the computer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 215–222.
Published Online: August 9, 2004
...H. Bhowmik; C. P. Tso; K. W. Tou Steady-state experiments are performed to study the convection heat transfer from four in-line simulated chips in a vertical rectangular channel using water as the working fluid. The experimental data cover a wide range for laminar flow under natural, mixed...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 193–199.
Published Online: July 13, 2004
... the wide range of laminar flow regime with Reynolds number, based on heat source length, from 800 to 2625. The applied uniform heat flux ranges from 1 to 7 W ∕ cm 2 . For flush-mounted heaters the heat transfer characteristics are studied and correlations are presented for four chips as well as for overall...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 213–224.
Published Online: July 8, 2004
... of three popular two-phase pressure drop models and correlations were compared to micro-channel water data, and only a separated flow (Lockhart-Martinelli) correlation based on the assumption of laminar flow in both phases gave acceptable predictions. Several popular heat transfer correlations were also...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
Published Online: June 10, 2003
... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 200–207.
Published Online: June 10, 2003
... convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow Design is the permanent struggle for better and better global system performance, under imposed constraints. This paper reviews a body of electronics cooling results that illustrate how...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 182–188.
Published Online: October 13, 2000
.... Schmidt. 13 October 2000 forced convection cooling packaging boundary layers laminar flow computational fluid dynamics Numerous practical applications in the design of electronics and telecommunications equipment depend upon low-velocity, laminar flow as a mechanism...