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Keywords: lead alloys
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031009.
Published Online: September 23, 2011
... was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model. 14 09 2010 13 05 2011 23 09 2011 deformation eutectic alloys lead alloys solders tensile strength tin alloys This work of authorship was prepared as an account...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041001.
Published Online: November 19, 2010
... roughness. Estimated activation energies for solder spreading were found to be in between those reported for inert and highly reactive spreading systems. 01 02 2010 03 10 2010 19 11 2010 19 11 2010 eutectic alloys interface phenomena lead alloys silver alloys solders surface...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031008.
Published Online: September 9, 2010
... underfilled with one of five different materials after soldering with SnCu, SAC305, and SnPb. 17 10 2009 06 06 2010 09 09 2010 09 09 2010 adhesion copper alloys flip-chip devices lead alloys reliability solders stress analysis thermal expansion thermal shock tin alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
... estimates of the actual fatigue curves. 29 10 2007 05 12 2008 25 02 2009 durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations Vibration loading is commonly encountered during the service life of electronic products...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 120–128.
Published Online: October 4, 2006
... scale, which is needed for use in strain gradient plasticity type constitutive models, is determined. The value of length scale is in agreement with values available in literature for different materials like copper, nickel, and aluminum. 16 06 2005 04 10 2006 solders lead alloys tin...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 278–286.
Published Online: July 20, 2006
... that the modified constitutive model is able to predict the complicated deformation of 63Sn–37Pb. The effects of axial stress, shear strain range, loading history, and strain rate on ratcheting behavior can be reflected fairly well. 23 02 2006 20 07 2006 lead alloys materials properties...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 195–204.
Published Online: June 23, 2006
.... 307 – 312 . fatigue testing creep solders finite element analysis stress-strain relations electronics packaging eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography Many factors can affect...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 82–89.
Published Online: May 21, 2006
... correlation to the creep deformation and that the correlation is different for lead-free and lead-containing solder alloys. 06 12 2005 21 05 2006 solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys Lead-free solder alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... analysis atomic force microscopy focused ion beam technology eutectic alloys lead alloys tin alloys aluminium zincation electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) Electroless nickel immersion gold (ENIG) for under bump metallurgy (UBM) is gaining interest...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 202–207.
Published Online: November 24, 2005
...-chip devices assembling solders voids (solid) eutectic alloys copper alloys tin alloys lead alloys silver alloys Solder alloy are commonly used for bonding computer chips to carriers and packages. The reliability of solder joints has become more critical, as electronic components...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 483–495.
Published Online: March 21, 2005
... circuit manufacture solders tensile testing printed circuit testing finite element analysis tin alloys silver alloys lead alloys failure analysis testing 62/63/2 solder in situ solder characterization area array package chips BGA printed wiring boards test methods failure modes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 440–445.
Published Online: January 4, 2005
... 04 01 2005 solders cooling flip-chip devices melting microassembling directional solidification integrated circuit packaging voids (solid) lead alloys tin alloys silver alloys reflow soldering In a flip chip assembly, the solder joints connecting the chip and its circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 407–414.
Published Online: December 24, 2004
... 2004 electronics packaging fatigue testing solders life testing shear strength creep testing ductility tin alloys lead alloys Solders have been used as a connection material between electric parts. They receive low cycle fatigue damage during on/off switching caused...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 430–439.
Published Online: December 21, 2004
... balls. 08 06 2004 21 12 2004 ball grid arrays creep solders soldering assembling printed circuit manufacture stress relaxation stress-strain relations tin alloys lead alloys silver alloys integrated circuit packaging finite element analysis creep strain rate 62%Sn–36...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 147–156.
Published Online: September 14, 2004
... Processing and Manufacturing Division Grant 9812686, University of Arizona, Tucson, AZ ). Limitations on the range of validity of the elastoplastic and the Perzyna elastoviscoplastic formulations are discussed. 13 10 2003 14 09 2004 tin alloys lead alloys eutectic alloys solders...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 237–244.
Published Online: May 26, 2004
.... A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition. 01 10 2003 26 05 2004 tin alloys lead alloys silver alloys copper alloys solders ball grid arrays printed circuit testing fatigue testing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 120–126.
Published Online: May 18, 2004
... with the interpretation on the formation of voids by thermocapillary theory, however, the results do show that heat flux direction plays significant role in the formation and distribution of void bubbles in molten solder. 12 01 2004 18 05 2004 lead alloys silver alloys tin alloys solders flip-chip...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 100–105.
Published Online: April 30, 2004
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2001; final revision, October 2003. Associate Editor: Z. Suo. 01 June 2001 01 October 2003 30 04 2004 solders tin alloys lead alloys fatigue viscoplasticity creep...