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Keywords: masks
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Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
Published Online: March 14, 2003
...Timothy Ferguson, Mem. ASME; Jianmin Qu, Fellow ASME In a previous study, we found that moisture preconditioning strongly influenced the interfacial fracture toughness of the underfill/solder mask interface, decreasing the interfacial adhesion by approximately one-half for both classifications...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
Published Online: May 2, 2002
... with respect to the acceleration of the onset of package delamination. In this paper the effect of moisture on the interfacial fracture toughness of two no-flow underfill materials with a commercially available solder mask coated FR-4 board is experimentally determined. Bilayer specimens with prefabricated...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 37–44.
Published Online: August 18, 1999
...Wen-Hwa Chen, Professor; Kuo-Ning Chiang, Associate Professor; Shu-Ru Lin, Graduate Student This study presents an efficient method to accurately predict solder joint geometry after a reflow process. The proposed method can be utilized for Solder Mask Defined (SMD), Non-Solder Mask Defined (NSMD...