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Keywords: metal foams
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041007.
Published Online: November 24, 2010
... 24 11 2010 aluminium boundary layers computational fluid dynamics contact resistance convection finite volume methods heat sinks metal foams With the development of new high power-density electronics arises the need for more effective means of dissipating the excess heat...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034501.
Published Online: June 12, 2009
... 11 2007 18 02 2009 12 06 2009 convection flow through porous media metal foams convection heat sink metal foam graphite foam electronics cooling Commercially produced metal foams are typically made from aluminum, nickel, steel, copper, and some of their alloys...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... properties. 21 11 2007 07 01 2009 27 03 2009 aluminium computational fluid dynamics finite volume methods forced convection heat conduction heat sinks metal foams stratified flow thermal conductivity With the advent of higher performing computer chips arises the need...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 113–119.
Published Online: August 11, 2006
...Sheng-Chung Tzeng; Tzer-Ming Jeng This work experimentally and numerically investigates the heat transfer in uncompressed∕compressed metal foams. Experiments were conducted to obtain the thermal characteristics of a rectangular channel filled with aluminum foams using air as the fluid medium...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 259–266.
Published Online: September 23, 2005
...A. Bhattacharya; R. L. Mahajan In this paper, we present our recent experimental results on buoyancy-induced convection in aluminum metal foams of different pore densities [corresponding to 5, 10, 20, and 40 pores per in. (PPI)] and porosities (0.89–0.96). The results show that compared to a heated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received June 2003; final revision, February 2004. Associate Editor: D. Agonafer. 01 June 2003 01 February 2004 06 10 2004 copper transient analysis metal foams bismuth...