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Keywords: microchannel
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041007.
Paper No: EP-21-1084
Published Online: November 22, 2021
...D. Sathish Kumar; S. Jayavel Miniaturization of electronic components requires compact and effective cooling techniques to dissipate large heat flux without a significant increase in pumping power. Microchannel heat sink with liquid as working fluid is a suitable technique for the purpose...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031006.
Paper No: EP-18-1092
Published Online: May 17, 2019
...Kan Zhou; Hua Zhu; Wei Li; Junye Li; Kuang Sheng; Shuai Shao; Haiwang Li; Zhi Tao Recently, microchannel heat sinks have been emerged as a kind of high performance cooling scheme to meet the heat dissipation requirement of electronics packaging and integration. In this study, an experimental...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021001.
Paper No: EP-13-1044
Published Online: April 29, 2014
... and obstacles has considerable effect on the heat transfer performance. The range of Nu/Nu 0 in microchannels with grooves and obstacles is 1.446–26.19 in different cases. With the increase of Reynolds number, the Nu/Nu 0 value is also increased. Comparing the value of Nu/Nu 0 in all cases, we conclude...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021004.
Paper No: EP-13-1076
Published Online: April 29, 2014
... Sinking for VLSI ,” IEEE Electron Device Lett. , 2 (5), pp. 126 – 129 . 10.1109/EDL.1981.25367 [2] Alessandro , B. , Musi , B. B. , and Spiga , M. C. , 2006 , “ Performance of a Polymeric Heat Sink With Circular Microchannels ,” Appl. Therm. Eng. , 26 (8–9), pp. 787 – 794...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041002.
Published Online: December 8, 2011
... power electronics, and space systems. This paper addresses (a) the implementation of two-phase microchannel heat sinks in these applications, (b) the fluid physics and limitations of boiling in small passages, and effective tools for predicting the thermal performance of heat sinks, and (c) means...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
Published Online: March 2, 2006
...X. J. Wei; Y. K. Joshi; P. M. Ligrani Steady, laminar flow and heat transfer, inside a rectangular microchannel with a dimpled bottom surface, are numerically studied. The microchannel is 50 × 10 − 6 m ( 50 μ m ) deep and 200 × 10 − 6 m ( 200 μ m ) wide. The dimples are placed in a single row along...