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Keywords: microfluidics
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
Published Online: November 24, 2010
... 2010 24 11 2010 diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance Heat dissipation in compact spaces with very high intensity is frequently encountered in the current designs of electronic devices. First...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031003.
Published Online: September 9, 2010
... with the theoretically calculated displacement values obtained from UV irradiation flux. Moreover, the displacement during photo-curing appeared to be proportional to the increase in temperature. 13 11 2009 24 04 2010 09 09 2010 curing flow visualisation holography microfluidics...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models semiconductor devices semiconductor materials semiconductor thin films thermoelectric devices thin film devices Thermoelectric cooling is used for temperature stabilization and control...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021010.
Published Online: April 3, 2009
... drops laminar flow microfluidics two-phase flow Two-phase micropin-fin heat sinks that utilize arrays of microsize pin-fin as internal heat transfer enhancement structures and capitalize on latent heat exchange associated with liquid flow boiling have recently emerged as a promising...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
Published Online: February 20, 2006
..., fluidic channel dimension, and cooling location optimizations have been investigated. 12 05 2005 20 02 2006 printed circuits cooling thermal management (packaging) jets microfluidics flow Advanced cooling techniques are required for highly integrated microsystems ( 1...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 503–511.
Published Online: April 20, 2005
...Jivtesh Garg; Mehmet Arik; Stanton Weaver; Todd Wetzel; Seyed Saddoughi Microfluid devices are conventionally used for boundary layer control in many aerospace applications. Synthetic jets are intense small-scale turbulent jets formed from periodic entrainment and expulsion of the fluid in which...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 381–390.
Published Online: December 17, 2004
... procedure. 25 02 2004 17 12 2004 thermal management (packaging) heat sinks integrated circuit packaging two-phase flow microfluidics channel flow coolants Thermal engineers in the electronics industry are facing unprecedented challenges of removing enormous amounts of heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
...Kazuyoshi Fushinobu; Masashi Nakata A microfluidic mixing device for microsystems with electroosmotic flow (EOF)-driven liquid pumping is proposed and examined experimentally and numerically. Microchannels with SiO 2 or Al 2 O 3 wall are fabricated by using surface micromachining technique...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2005, 127(3): 357–361.
Published Online: August 5, 2004
... including the height, size, and spacing of the roughness elements on the Poiseuille number. The fluid temperature effects are also investigated numerically for the rough channels. 06 04 2004 05 08 2004 channel flow microfluidics Poiseuille flow friction surface roughness thermal...