... microchannel flow micromechanical devices surface chemistry Micropost-filled reactors are commonly found in many micro-total analysis system applications because of their large surface area for the surrounding volume. Optimal fabrication of such devices by increasing the arrays of posts with smaller...

... microrefrigerator (( c ) and ( d )) as a function of the thermoelectric layer thickness 05 11 2009 20 04 2010 08 09 2010 bismuth compounds contact resistance cooling Ge-Si alloys heat transfer microfluidics micromechanical devices Peltier effect refrigeration refrigerators...

... detection life testing micromechanical devices pressure sensors vacuum techniques vacuum packaging molecular flow leak rate MEMS packaging Much research on vacuum packaging was focused on the electronic vacuum tube packaging before MEMS emergence ( 1 2 3 4 ). Novel MEMS technologies...

... pipes heat transfer micromechanical devices micro heat pipe mathematical modeling vapor dynamics capillary limit vapor continuum Micro heat pipe is a small-scale device that efficiently transfers thermal energy to heat sink taking advantage of phase change phenomena. The concept...

... response for the continuous-lumped model ( 19 ) 09 01 2007 14 01 2008 29 07 2008 micromechanical devices printed circuits shock waves vibrations MEMS shock electrostatic force PCB motion Recently, there has been considerable interest in the reliability...

.... 04 07 2007 03 10 2007 25 04 2008 fluidics lubricants micromechanical devices monolayers self-assembly substrates fluidic self-assembly (FSA) self-assembled monolayer (SAM) micropart lubricant Recent advances in miniaturization and microfluidics technologies...

... Science Foundation of China under Grant No. 90207013 and 985 project of Peking University, China. silicon conducting polymers micromechanical devices micromachining adhesive bonding fluorescence Raman spectra chip scale packaging photoresists DNA PCR Microchip Array Polymer...

... packaging micromechanical devices optical fibre couplers internal stresses coupled mode analysis optical fibre losses finite element analysis micro-optics The increasing demands for miniaturization, high electrical performance, and high input/output (I/O) pin count have led significant...

... devices micromechanical devices finite element analysis bonding processes assembling micromachining 01 July 2003 30 04 2004 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received July 2003...

.... Dudek, B. Vandevelde, M. Meuwissen, A. Wymyslowski, G. Hanreich and E.H. Wong. L. J. Ernst G. Q. Zhang 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis ...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD September 1, 2000, Associate Editor: B. Michel. 01 September 2000 14 03 2003 piezoelectric devices piezoelectric thin films micromechanical devices finite element analysis stress analysis stress-strain relations...

... of the intrinsic stress is re-induced back in the spring, and it varies linearly with compression for most of the compression range. The stress reaches a constant value after a certain compression range. micromechanical devices probes integrated circuit testing production testing fine-pitch technology...

...Marta Rencz ,, Guest Editor; Clemens Lasance ,, Guest Editor integrated circuit packaging micromechanical devices integrated circuit modelling thermal management (packaging) Microelectronics thermal experts from four continents gathered in the fall of 2000 at the Sixth Therminic...

...E. Suhir,, Editor reliability packaging integrated circuit technology integrated optics micromechanical devices micro-optics Knowledge at the intersection of reliability, mechanical, materials, chemical, electrical, optical, manufacturing and software engineering holds the key...