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Keywords: microprocessor chips
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... are also included in the superposition results, which makes it possible to model a large number of transistors on a silicon chip. The capabilities of the proposed methodology are demonstrated through a case study involving thermal modeling and analysis of a microprocessor chip with 4 × 10 6 transistors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... microprocessor chips temperature control thermal resistance Data center cooling thermal management chip to cooling tower energy efficiency heat sink © 2010 IEEE. Reprinted with permission from the “12th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021008.
Published Online: June 25, 2010
... packaging microprocessor chips minimisation thermal management (packaging) In earlier microprocessor generations, the required instructions for the core processor were stored and channeled via the bus from the main memory. In contemporary generations, technology has made it practical to integrate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021009.
Published Online: April 2, 2009
... temperature and outdoor air conditions is also presented. 30 06 2008 10 12 2008 02 04 2009 air conditioning computer centres cooling heat transfer mechanical engineering computing microprocessor chips sensitivity analysis thermodynamics ubiquitous computing The use...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
... logic circuits microprocessor chips numerical analysis temperature distribution As the performance of microprocessor increases, the need to supply data and instructions to the core processor increases accordingly. In the past, this information, which normally resides in main memories...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... significant factor of the three tested and indicates that the presence of fins as short as 0.5 mm may play a role in reducing hysteresis in the boiling curve. 04 01 2006 31 08 2007 04 02 2008 coatings cooling electronics packaging evaporation heat conduction microprocessor chips...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
Published Online: March 28, 2007
... and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at − 80 ° C . Four compact evaporator designs are examined—a base line slit-flow structure with no microfeatures, straight...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 172–176.
Published Online: February 16, 2006
... device can be easily retrofitted into existing systems; improving performance without major channel and/or fan modifications. 10 12 2004 16 02 2006 thermal management (packaging) heat sinks microprocessor chips integrated circuit packaging forced convection The state...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 346–352.
Published Online: December 6, 2005
... performance will be hindered by the need for large power supplies and high-capacity heat rejection systems. 27 04 2005 06 12 2005 microprocessor chips power consumption electronics packaging exergy exergy energy efficiency information processing brain information processing...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 10–17.
Published Online: May 18, 2005
... possible configurations for the solution presented. 29 07 2004 18 05 2005 heat sinks thermal management (packaging) chip scale packaging heat conduction thermal conductivity microprocessor chips Thermal management of electronic packages and systems is one of the key technical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
Published Online: October 6, 2004
... 2003 01 April 2004 06 10 2004 microprocessor chips thermal resistance integrated circuit packaging flip-chip devices thermal stresses temperature distribution cooling flow simulation In the past decade, simulation procedures and tools have improved tremendously in every...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 20–27.
Published Online: August 17, 1999
... August 1999 semiconductor device packaging flow simulation finite element analysis microprocessor chips compressible flow encapsulation viscosity chip-on-board packaging Semiconductor chips are often encapsulated with an epoxy-molding compound (EMC) for protection and optimal use...