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Keywords: mode-I
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
Published Online: March 7, 2024
... the experimental findings, and it is used in the computation of fracture toughness values. The fracture toughness values are compared for the various epoxy/PCB systems based on the number of days of thermal aging and the method of flexure testing. A cohesive zone model has been constructed for predominantly mode-I...
