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Keywords: modeling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011001.
Published Online: March 19, 2012
.... In the current study, a new inclusive multiphysics (involving mechanical, electrical, and thermal fields) finite element model (FEM) of a 35A automotive connector has been developed. The contact resistance is predicted using a multiscale rough surface contact method and is embedded in the multiphysics FEM...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
... to the thermal loading than the Al–Cu interface. The thermal loading and mechanical test models proposed here can be used to evaluate interfacial properties under the effects of heat transferring. Three snapshots at the different stage of the indentation process for Cu–Al model Figure 4 shows...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 291–293.
Published Online: August 27, 2005
...Mahidhar Rayasam; Ganesh Subbarayan In this technical brief, we describe a simple, yet versatile solder shape prediction model that can handle inclination (as is likely to occur when warped substrates are used) and misalignment of the top pad of the solder joint relative to the bottom pad...