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Keywords: modules
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2011, 133(4): 044502.
Published Online: December 9, 2011
...Wei Han; Marc Rensing; Peter O’Brien; Frank H. Peters In this paper, the packaging aspects of directly modulated laser (DML) modules are investigated using detailed electromagnetic (EM) simulations. The packaging influences of the laser module are specified in two parts as RF connector...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
... was less than 20 times the line pattern width. 22 04 2008 11 12 2008 02 04 2009 computational fluid dynamics electronics packaging modules printed circuits semiconductor junctions thermal conductivity 3D module PCB pattern trace semiconductor junction temperature CFD...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 1–8.
Published Online: April 16, 2006
... in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
Published Online: August 15, 2005
...Hua Ye; Harry Efstathiadis; Pradeep Haldar Understanding the thermal performance of power modules under liquid nitrogen cooling is important for the design of cryogenic power electronic systems. When the power device is conducting electrical current, heat is generated due to Joule heating. The heat...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 59–66.
Published Online: March 21, 2005
... for the case studied, thus, providing an increase in the IPEM’s overall performance. Manuscript received May 15, 2003; revision received July 26, 2004. Review conducted by: S. McKeown. 15 May 2003 26 July 2004 21 03 2005 modules thermal management (packaging) power integrated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
Published Online: January 24, 2005
...M. Herna´ndez-Mora; J. E. Gonza´lez; M. Ve´lez-Reyes; J. M. Ortiz-Rodrı´guez; Y. Pang; E. Scott Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
Published Online: January 24, 2005
...Yasin Makwana; Dereje Agonafer, Fellow ASME; Dan Manole The combination of increased power dissipation and increased packaging density has led to substantial increases in chip and module heat flux in high-end computers. The challenge is to limit the rise in chip temperature above the ambient...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 491–500.
Published Online: January 24, 2005
... modules heat exchangers product development cooling Electronic devices and equipment now permeate virtually every aspect of our daily life. Among the most ubiquitous of these is the electronic computer varying in size from the handheld personal digital assistant to large scale mainframes...
Topics: Cooling
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 362–368.
Published Online: September 17, 2003
...Seong-Yeon Yoo; Jong-Hark Park; Min-Ho Chung When heat is released by forced convection from electronic modules in a narrow printed circuit board channel, complex flow phenomena—such as stagnation and acceleration on the front surface, separation and reattachment on the top surface, wake or cavity...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 13–19.
Published Online: August 13, 1999
... decisions at system-level, during package development by enabling one to develop a reusable library of modules in a manner analogous to the object-oriented programming paradigm of modern computer science. The methodology allows simultaneous design as well as domain decomposition and is based on a nonlinear...