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Keywords: moisture
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021004.
Published Online: June 11, 2010
... the overall effectiveness of the TIM. Although significant amount of work has been done on understanding the thermal and moisture effects of various polymer materials used in microelectronic package assemblies, very limited work has been done to study the effect of temperature and moisture on TIM delamination...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 421–426.
Published Online: April 24, 2007
...Samson Yoon; Bongtae Han; Zhaoyang Wang Thermal-moisture analogy schemes for a moisture diffusion analysis are reviewed. Two schemes for practical applications are described using the governing equations of heat and mass diffusions: (1) direct analogy and (2) normalized analogy. The schemes...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
...Xu Chen; Shufeng Zhao; Linda Zhai The moisture absorption experiments of two kinds of molding compound are conducted. The diffusion at low temperature and humidity observes the Fick’s Law, but it does not strictly obey at higher temperature and humidity. The phenomena can be attributed...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 24–30.
Published Online: March 14, 2003
...Timothy Ferguson, Mem. ASME; Jianmin Qu, Fellow ASME In a previous study, we found that moisture preconditioning strongly influenced the interfacial fracture toughness of the underfill/solder mask interface, decreasing the interfacial adhesion by approximately one-half for both classifications...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
Published Online: March 14, 2003
.... This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
...C. L. Chung; James Fan; M. L. Huang; F. J. Tsai In this paper, the study on failure mechanism of moisture sensitivity reliability is reported. It focuses on the PCT conditions which are 121°C, 2atm, 100RH%, and 168 hr. The general failure mode is delamination on the interface between die attach...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 106–110.
Published Online: May 2, 2002
...Timothy Ferguson, Member ASME; Jianmin Qu, Fellow ASME Moisture poses a significant threat to the reliability of microelectronic assemblies and can be attributed as being the principal cause of many premature package failures. Of particular concern is characterizing the role of moisture...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 122–126.
Published Online: May 2, 2002
... moisture conditioning was found to be significant compared to the thermal stress during solder reflow. Hygroscopic stress in over-molded wire bond PBGA and molded Flip Chip PBGA was found to be 1.3 times to 1.5 times that of thermal stress. Hygroscopic swelling of the underfill in FCPBGA was found...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
Published Online: January 1, 2000
...H. Fre´mont; J. Y. Dele´tage; A. Pintus; Y. Danto Plastic encapsulated devices are of great interest against their ceramic or metallic counterparts, as they permit significant cost reductions. However, they are more sensitive to moisture ingress, which can lead to reliability problems. Moisture can...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
Published Online: September 2, 1998
...M. Uschitsky; E. Suhir Mechanical reliability of epoxy molding compounds in plastic packages of integrated circuits (IC) is greatly affected by the compound ability to absorb moisture. Accordingly, the objective of the study is to evaluate the effect of moisture sorption on the mechanical...