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Keywords: moulding
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2010, 132(1): 014502.
Published Online: March 4, 2010
... computational model for the simulation of practical epoxy molding compound encapsulation. 12 08 2007 28 09 2009 04 03 2010 04 03 2010 encapsulation finite difference methods integrated circuit packaging moulding plastic packaging semiconductor process modelling two-phase flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
... and surface mount device compatible features, making it suitable for portable commercial devices. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding photoresists piezoresistive devices pressure sensors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
... integrated circuit packaging integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method As the integrated circuit (IC) functions develop toward more lead counts, high efficiency and high...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
... packaging reliability moisture humidity vapour pressure moulding Moisture plays an important role in the reliability of plastic electronic packaging. The presence of moisture in the plastic package induces hygroscopic stress through hygroswelling, induces vapor pressure that is responsible...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
..., it was found that higher-order elements, such as hexahedra or prisms, are more suitable than tetrahedra. 19 04 2004 02 12 2004 integrated circuit manufacture plastic packaging electronics packaging encapsulation moulding mass production Paddle Shift Mold-Filling Analysis Transfer...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 34–36.
Published Online: April 30, 2004
...David J. J. Lowrie Two high profile goals of the electronics industry today are lead free and embedded passives. The following describes the design and construction of a populated and planarized “PCB” which accomplishes these goals. The Moulded Electronic Package also integrates bare die and other...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity At present, thermo-mechanical reliability of integrated circuit (IC) packages is still one of the major concerns in the electronic industry. Critical stress levels may be induced in the package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
... based on the reliable prediction of the packaging process stresses. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Nov. 2002. 01 Nov 2002 15 12 2003 packaging moulding encapsulation...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. June 2003, 125(2): 268–275.
Published Online: June 10, 2003
... integrated circuit packaging Taguchi methods moulding circuit CAD integrated circuit design TSOP II LOC Package Taguchi Method Mold-Flow Balance In LOC (lead on chip) packaging, inner leads of the leadframe are arranged right above the chip rather than surrounding the chip. The process...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 31–38.
Published Online: March 14, 2003
... moulding plastic packaging integrated circuit packaging delamination thermal stress cracking bending finite element analysis reflow soldering failure analysis Plastic packaging is the most popular technique in electronic packaging because of its low costs and ease of manufacture. However...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
Published Online: March 14, 2003
.... Associate Editor: B. Michel. 12 April 2002 14 03 2003 integrated circuit packaging encapsulation drag moulding wires (electric) electronic engineering computing integrated circuit reliability Wire sweep, which refers to excessive wire deformation during encapsulation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
... 12 12 2002 chip scale packaging failure analysis reliability substrates organic compounds moisture delamination moulding BT Substrate PCT (Pressure Cooked Test) Mold Compound Moisture Uptake CSP(Chip Scale Package) Failure Mechanism Reliability For the current...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
Published Online: December 12, 2002
.... Contributed by the Electronic and Photonic Packaging Division and presented at Poly 2000, London, United Kingdom, December 4–5, 2000. Manuscript received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 polymers moulding equations...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 111–114.
Published Online: May 2, 2002
.... Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD April 20, 2001. Associate Editor: B. Michel. 20 April 2001 02 05 2002 replica techniques moulding optical fabrication optical disc...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
Published Online: February 6, 2001
... integrated circuit packaging plastic packaging electronic design automation encapsulation moulding Integrated circuits are used in virtually every electronic product available on the market today. These microcircuits are encapsulated or packaged in one of several different materials including...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 88–94.
Published Online: August 8, 2000
... and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters August 8, 2000. Associate Editor: B. Courtois 08 August 2000 ball grid arrays reliability moulding fine-pitch technology Plastic Ball Grid Array (BGA...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
Published Online: January 11, 2000
... design of, plastic packages. Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD January 11, 2000. 11 January 2000 silicon compounds filled polymers moulding thermal stresses...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 279–280.
Published Online: January 9, 2000
... . Manuscript received by the EEPD July 9, 1998; revised manuscript received January 9, 2000. Associate Technical Editor: B. Michel. 09 July 1998 09 January 2000 integrated circuit packaging thermal stresses soldering failure analysis integrated circuit reliability moulding integrated...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
Published Online: January 1, 2000
... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...