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Keywords: multilevel modelingClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling High temperature rise or steep temperature gradients within silicon chips often cause various reliability problems [( 1 2 )]. Despite the fact that these temperature-induced problems have been known for a long...