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Journal Articles

Evaluation of Stress Effects on Electrical Characteristics of N-Type MOSFETs: Variations of DC Characteristics During the Resin-Molding Process

Masaaki Koganemaru, Toru Ikeda, Noriyuki Miyazaki, Hajime Tomokage
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
https://doi.org/10.1115/1.4000718
Published Online: March 4, 2010
... (residual) stresses. The objective of our project is to evaluate the effects of stress on semiconductor devices. In this study, the shift of the DC characteristics of nMOSFETs during the resin-molding process was investigated experimentally. After a silicon chip including the n-type metal oxide...
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Topics: Electron mobility, Molding, Resins, Stress, Silicon