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Keywords: nanoelectronics
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Journal Articles
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2011, 133(2): 020301.
Published Online: July 1, 2011
...Tarek Ragab, Dr.; Cemal Basaran, Dr. carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes Since the first identification of carbon nanotubes in 1991, more than 60,000 research...
Journal Articles
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
Published Online: November 13, 2008
... 08 09 2008 13 11 2008 atomic force microscopy integrated circuit reliability nanoelectronics nanowires phase transformations Raman spectroscopy thermal resistance thermoreflectance Different methods for temperature measurement on the scale of modern electronic...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006
... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis The technological revolution that started with the introduction of the transistor just over half a century ago is without parallel in the way it has shaped our economy and our daily lives. The current trend...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 157–163.
Published Online: September 15, 2004
... investigated 22 12 2003 15 09 2004 power electronics nanoelectronics flip-chip devices soldering electromigration current density microassembling reliability Flip Chip Solder Joint Reliability Electromigration Thermomigration Current Stressing High Current Density Power...