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Keywords: neural nets
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011010.
Published Online: March 10, 2011
... cooling copper electronics packaging laminar flow nanofluidics natural convection neural nets two-phase flow There has been a significant growth in the use of nanofluids in various industrial applications due to their enhanced thermophysical properties. Wong and De Leon ( 1 ) presented...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041002.
Published Online: November 19, 2010
... extraction method and the constructed artificial neural network in detecting and identifying bond quality. 01 02 2010 11 10 2010 19 11 2010 19 11 2010 band-pass filters data acquisition electronics packaging feature extraction Hilbert transforms lead bonding neural nets...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 90–97.
Published Online: April 19, 2006
... is applied to a test case involving placement optimization of several heat generating electronics components on a PCB. 12 12 2005 19 04 2006 printed circuit design thermal management (packaging) genetic algorithms neural nets circuit optimisation electronic component placement...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
Published Online: November 16, 2004
.... This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level. 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 6–12.
Published Online: December 9, 1999
... neural nets fatigue moire fringes The fatigue life of solder joints in an area array package depends on the geometric shape, the choice of the solder alloy and its microstructure, and on the applied load, which is typically a thermal cycle. The interaction between a solder joint and the package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2000, 122(1): 13–19.
Published Online: August 13, 1999
... Technical Editor: B. Courtois. 10 February 1999 13 August 1999 packaging modules neural nets finite element analysis soldering integrated circuit packaging design engineering Materials used in the construction of electronic packages are often complex in their behavior...