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Keywords: numerical analysis
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
Published Online: September 14, 2011
... density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... than that made from SAC105 no matter on Cu or electroless Ni. Moreover, the fracture was found at the interface between the Cu foil and epoxy in the halogen-free test device. Numerical analysis showed that the thickness of IMC layer dominated the pull strength of the solder joint because the Z-axial...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021002.
Published Online: May 20, 2010
... of up to 135% for the facility with 56% open tiles while the average and maximum changes for the facility with 25% open tiles are 6% and 60%, respectively. 21 04 2009 17 02 2010 20 05 2010 20 05 2010 air conditioning computer centres numerical analysis data center...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031010.
Published Online: July 31, 2009
... diffusion integrated circuit packaging moisture numerical analysis vapour pressure direct concentration approach (DCA) moisture diffusion vapor pressure reflow electronic package multiscale analysis Moisture plays an important role in the integrity and reliability of plastic...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031012.
Published Online: July 31, 2009
... demonstrated the relevance of the present approach, future developments of this research will have to put together the different evaluation criteria presented in an only performance parameter. 29 07 2008 30 01 2009 31 07 2009 heat conduction heat exchangers numerical analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011005.
Published Online: February 12, 2009
... Based Optimization of Functional Block Distributions in a Non-Uniformly Powered Die,” InterPACK 2005, San Francisco, CA, Jul. 17–22 ) has been done, which includes numerical analysis and thermal based optimization of a typical package consisting of a nonuniformly powered die, heat spreader, thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011001.
Published Online: February 11, 2009
... such an index of the first several cycles is followed in the predictions. 23 08 2007 15 04 2008 11 02 2009 ball grid arrays chip scale packaging circuit reliability numerical analysis thermal analysis An earlier version of this paper was published in Proceedings of IMECE 2007...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
...) detailed numerical analysis models directly connected to optimization algorithms, (2) design of experiments (DoE), and (3) artificial neural networks (ANNs) have been proposed as new trends in this field. These methodologies have led to significant improvement in design optimization capabilities, while...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
Published Online: February 12, 2008
... 2006 25 06 2007 12 02 2008 numerical analysis optoelectronic devices scanning electron microscopes soldering solders surface tension fiber attachment soldering solder joint geometry self-alignment Alignment accuracy is a serious concern in coupling single-mode...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 115–124.
Published Online: January 19, 2006
... 01 2006 semiconductor thin films Boltzmann equation ballistic transport thermal conductivity phonon dispersion relations numerical analysis Current microfabrication technologies have allowed the semiconductor industry to produce smaller electronic devices and components...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 18–24.
Published Online: March 21, 2005
... presents a fundamental concept and principles of resin self-alignment processes. The numerical analysis is conducted to enhance understandings of resin self-alignment behavior and the relationship between process-related parameters. It was proved that resin self-alignment is different from the oscillatory...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... flow simulation jets optimisation numerical analysis Enhancement of the cooling of electronic modules and packages can be accomplished by a variety of techniques, such as increasing the air flow rate, increasing the surface area through the use of heatsinks, or improving the air flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
Published Online: January 24, 2005
... ventilation natural convection numerical analysis flow simulation The power dissipation density of electronic equipment has increased in recent years and, as a result, it is necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
Published Online: January 24, 2005
... 2005 modules power electronics electronics packaging reduced order systems heat transfer thermal analysis numerical analysis Integrated Power Electronics Reduced Thermal Model Lumped Thermal Capacitance The present technology provides the continuous development of new...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
Published Online: January 24, 2005
.... Review conducted by: Z. Suo. 08 October 2003 14 June 2004 24 01 2005 thermal management (packaging) chip scale packaging natural convection thermal analysis laminar flow coolants water numerical analysis surface mount technology Advances in the computer...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
Published Online: January 24, 2005
... Editor: B. Sammakia. 01 May 2003 01 April 2004 24 01 2005 semiconductor lasers optical modulation optical communication equipment thermal resistance numerical analysis The tremendous increase in the number of users and multimedia and real time applications has led...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
Published Online: January 24, 2005
... resistance thermal conductivity radio equipment lead bonding thermal analysis microassembling numerical analysis Projected increases in interconnect density and requirements for higher clock rates for digital electronics define the need for improvements in traditional microelectronic packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
Published Online: January 24, 2005
... May 2004 05 October 2004 24 01 2005 electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
Published Online: August 9, 2004
... 2004 silicon compounds alumina microfluidics micromachining channel flow electrophoresis osmosis numerical analysis mixing Recent progress of the surface micromachining technology expands the frontier of engineering applications. Some of them include microsystems that handle tiny...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 186–194.
Published Online: July 8, 2004
.... 01 April 2003 01 November 2003 08 07 2004 solders flow through porous media plastic flow permeability numerical analysis flip-chip devices flow simulation Flip chip interconnects are being used in the electronics industry and have inherent advantages over other...