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Keywords: optimisation
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
Published Online: December 9, 2011
... error was reduced from 50% to 3.3% for the 36 pillar array. 28 05 2010 24 08 2011 09 12 2011 09 12 2011 finite element analysis flip-chip devices optimisation In chip-to-substrate connections, the flip-chip connection has become important in high-performance...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number of benefits...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
Published Online: September 9, 2010
... cooling electronics packaging optimisation To address the issues of acoustic noise and energy expense associated with the use of cooling fans and to enhance operational reliability, natural convection cooling is often preferred for electronic equipment. However, the heat transfer associated...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. September 2008, 130(3): 034001.
Published Online: July 30, 2008
... they require intensive computational effort. Advantages as well as disadvantages of these methods are discussed. 05 06 2007 06 12 2007 30 07 2008 design of experiments electronic design automation electronics packaging neural nets numerical analysis optimisation...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
Published Online: November 5, 2006
... couples and the area-to-height ratio of the thermoelectric pellet. In the present study, the optimization problems are solved numerically using the so-called multistart adaptive random search method. 28 07 2006 05 11 2006 cooling optimisation thermal resistance thermoelectric devices...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
Published Online: January 24, 2005
... flow simulation jets optimisation numerical analysis Enhancement of the cooling of electronic modules and packages can be accomplished by a variety of techniques, such as increasing the air flow rate, increasing the surface area through the use of heatsinks, or improving the air flow...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 397–406.
Published Online: December 21, 2004
... thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 306–313.
Published Online: November 16, 2004
.... This methodology can be applied to any electronic product design at any packaging level from the system level to the chip level. 20 10 2003 16 11 2004 ball grid arrays thermal management (packaging) neural nets optimisation Multidisciplinary Design Electronics Packaging Neural Networks...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
Published Online: July 8, 2004
... . Manuscript received April 2003; final revision, January 2004. Associate Editor: Z. Suo. 01 April 2003 01 January 2004 08 07 2004 integrated circuit interconnections integrated circuit packaging electroplating optimisation photolithography reliability integrated circuit...
Journal Articles
Article Type: Foreword
J. Electron. Packag. December 2003, 125(4): 465.
Published Online: December 15, 2003
...L. J. Ernst, Guest Editor; G. Q. Zhang, Guest Editor 15 12 2003 thermal management (packaging) digital simulation optimisation micromechanical devices failure analysis This special issue includes selected papers presented at the International Conference of Thermal...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 208–216.
Published Online: June 10, 2003
... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2001, 123(2): 132–140.
Published Online: September 14, 2000
...; revised manuscript received September 14, 2000. Associate Editor: J. Lau. 30 August 1999 14 September 2000 ball grid arrays plastic packaging optimisation finite element analysis matrix decomposition circuit analysis computing printed circuit design New products...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 341–349.
Published Online: February 25, 2000
... by the EEPD July 13, 1999; revised manuscript received February 25, 2000. Associate Technical Editor: B. Michel. 13 July 1999 25 February 2000 vibrations modal analysis supports optimisation printed circuit design In many engineering structures, one is normally interested...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 152–159.
Published Online: October 20, 1999
... printed circuits heat transfer cooling convection optimisation printed circuit design The optimal placement of components on printed wiring boards requires satisfying multiple, possibly conflicting, design objectives. As pointed out by Moresco 1 , these design objectives may be very...