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Keywords: package-on-package
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Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
...Hsiu-Ping Wei; Yu-Hsiang Yang; Bongtae Han A comprehensive stochastic model is proposed to predict Package-on-Package (PoP) stacking yield loss. The model takes into account all pad locations at the stacking interface while considering the statistical variations of the warpages and the solder ball...
View Article titled, Stacking Yield Prediction of <span class="search-highlight">Package</span>-on-<span class="search-highlight">Package</span> Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
Open the PDF for Stacking Yield Prediction of <span class="search-highlight">Package</span>-on-<span class="search-highlight">Package</span> Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development in another window
Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
...Hsiu-Ping Wei; Yu-Hsiang Yang; Bongtae Han The stochastic model for yield loss prediction proposed in Part I is implemented for a package-on-package (PoP) assembly. The assembly consists of a stacked die thin flat ball grid array (TFBGA) as the top package and a flip chip ball grid array (fcBGA...
View Article titled, Stacking Yield Prediction of <span class="search-highlight">Package</span>-on-<span class="search-highlight">Package</span> Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
Open the PDF for Stacking Yield Prediction of <span class="search-highlight">Package</span>-on-<span class="search-highlight">Package</span> Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model in another window
Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints