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Keywords: piezoresistive gauge
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...
