.... diamond fluid oscillations gold heat pipes microfluidics pipe flow thermal management (packaging) thermal resistance 06 04 2010 31 07 2010 24 11 2010 24 11 2010 2010 American Society of Mechanical Engineers ...

... OF ELECTRONIC PACKAGING . Manuscript received Nov. 2003; final revision, Jan. 2004. Associate Editor: Guo-Quan Lu. 01 Nov 2003 01 Jan 2004 06 10 2004 cooling pipe flow condensation silicon boiling two-phase flow integrated circuit packaging Direct and indirect liquid...

... computational fluid dynamics thermal management (packaging) pressure flow simulation pipe flow The trend in modern electronic systems design is to increase the speed and power of processing while at the same time reducing the size and weight of the electronic device 1 . The electronic systems can...

... convection cooling external flows pulsatile flow pipe flow channel flow boundary layers laminar flow Design is the permanent struggle for better and better global system performance, under imposed constraints. This paper reviews a body of electronics cooling results that illustrate how...

.... 06 August 2001 10 06 2003 heat sinks packaging cooling thermal conductivity pipe flow forced convection Heatsinks for processors have evolved in recent years as power has increased. The first personal computers required large enclosures for the low density packaging...

.... Culham. 12 October 2001 10 06 2003 heat pipes capillarity two-phase flow evaporation undercooling flow separation flow through porous media thermal conductivity pipe flow The control of operating temperature, regardless of power input, makes future use of CPL systems...

... in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters October 11, 2000. Associate Editor: R. Wirtz. 11 October 2000 microcomputers cooling computational fluid dynamics pipe flow heat sinks The central processor unit (CPU) in a desktop computer must...