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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041007.
Paper No: EP-19-1034
Published Online: October 18, 2019
... bending test point loading test bending strength dicing effect free edge stress The window glass substrates have been widely used in optical semiconductor and micro-electrical-mechanical system packages. For more applications, the glass substrates or interposers have been recently proposed...