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Keywords: polyimide substrate
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Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
DOI: https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
... Optical image for one of the dielectric pad junction with microvia from a two-layer sample 1 Corresponding author. e-mail:  lall@auburn.edu 31 03 2021 01 02 2022 11 03 2022 multi-layer micro-vias dielectric polyimide substrate additive printing resistance shear...
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Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Flexure and Twist Test Reliability Assurance of Flexible Electronics

Pradeep Lall, Jinesh Narangaparambil, Ben Leever, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031121.
Paper No: EP-20-1008
DOI: https://doi.org/10.1115/1.4047844
Published Online: August 7, 2020
... 01 2020 20 06 2020 07 08 2020 polyimide substrate additive printing resistance aerosol jet printing failure reliability flexing twisting The trend toward weight reduction and miniaturization of electronics is driving the emergence of flexible electronics. A number...
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Topics: Bending (Stress), Cycles, Failure, Reliability, Sintering, Temperature, Inks, Flexible electronics, Testing, Printing