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Keywords: potted electronics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
Published Online: March 7, 2024
... than other restraint technologies. In potted electronic assemblies, interfacial delamination at the epoxy and printed circuit board (PCB) interface has been one of the major failure modes. Interfacial delamination happens at the epoxy/PCB interface under dynamic shock loads, which leads to failures...
