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Keywords: potting
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2024, 146(3): 034502.
Paper No: EP-22-1028
Published Online: March 7, 2024
...Pradeep Lall; Aathi Raja Ram Pandurangan; Ken Blecker The survivability and reliability of commercial electronic components under very high thermo-mechanical loads are improved using underfilling and potting methods. Potting protects from operating conditions such as moisture, water, or corrosive...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041010.
Paper No: EP-13-1102
Published Online: September 19, 2014
... Methods Overmolding, Potting and Coating ,” 7th International Conference on Microsystems, Packaging, Assembly and Circuits Technology ( IMPACT ), Taipei, Taiwan, October 24–26, pp. 137−140 . 10.1109/IMPACT.2012.6420229 [13] Birkelund , K. , Nørgaard , L. , and Thomsen , E. V. , 2011...
