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Keywords: power semiconductor devices
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
Published Online: August 26, 2005
... power semiconductor devices cooling solders semiconductor device reliability finite element analysis thermal expansion thermal management (packaging) semiconductor device packaging finite element method soldering cooling Packaging of power semiconductor devices provides electrical...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 431–441.
Published Online: September 17, 2003
... cooling channel flow two-phase flow power semiconductor devices Several cooling schemes have been developed in recent years to combat the large increases in heat dissipation from electronic and power devices. Air-cooled heat sinks are presently found in most personal computers, but are rapidly...