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Keywords: printed circuits
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
...Valentin Bissuel; Michel Brizoux; Arnaud Grivon; Eric Monier-Vinard; Fabrice Pires Latest electronic component package types are pushing the need to more efficiently remove the dissipated heat using optimized thermal paths going through the printed circuit board (PCB) to reach PCB inner thermal...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031010.
Published Online: September 26, 2011
...John H. Lau; M. S. Zhang; S. W. Ricky Lee A low-cost (with bare chips) and high (optical, electrical, thermal, and mechanical) performance optoelectronic system embedded into a PCB (printed circuit board) or an organic laminated substrate is designed and described. This system consists of a rigid...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021004.
Published Online: June 23, 2011
... microstructure fracture integrated circuit interconnections numerical analysis printed circuits solders halogen free lead free solder alloy intermetallic characteristics joint strength The environmentally friendly green product is an irreversible trend for electronic industries, following...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
... that comparisons of test results may not reflect relative performances under service conditions. This was illustrated with for a set of model BGA components with 20 mil (0.5 mm) diameter SAC305 solder balls, which were reflow soldered onto printed circuit boards using a eutectic SnPb solder paste and tested...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
...K. C. Yung; H. Liem; H. S. Choy; W. K. Lun This paper reports the thermal performance of a high-brightness light-emitting diode (LED) array package with a novel placement method on a printed circuit board (PCB). The precise heat transfer analysis and modeling using computational fluid dynamics (CFD...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
...Yutaka Kumano; Tetsuyoshi Ogura; Toru Yamada A novel computational fluid dynamics analysis method of predicting semiconductor junction temperatures precisely without modeling printed circuit board (PCB) line patterns was developed. First, PCBs are divided into multiple regions. The effective...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
...Young K. Song; Chin C. Lee A flip-chip interconnect configuration with coplanar strip (CPS) lines on printed circuit boards (PCBs) is reported for millimeter-wave applications. For CPS lines, the signal and ground electrodes both lie on the top surface of a chip or substrate. The flip-chip...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044502.
Published Online: November 17, 2008
... of using the full-field measurement technique used in this study. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient response With the ever-growing market...
Journal Articles
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041106.
Published Online: November 14, 2008
...Wataru Nakayama An analytical model is developed to estimate the heat transfer performance of printed circuit board (PCBs). The PCB under study is the substrate for a ball-grid-array (BGA) package. Under the BGA, the PCB has a belt of densely populated through-vias that penetrate the laminate...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
Published Online: July 29, 2008
...Fadi Alsaleem; Mohammad I. Younis; Ronald Miles We present an investigation into the effect of the motion of a printed circuit board (PCB) on the response of a microelectromechanical system (MEMS) device to shock loads. A two-degrees-of-freedom model is used to model the motion of the PCB...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021001.
Published Online: April 15, 2008
...Pavel Simacek; Suresh G. Advani; Kossi Zonvide; Leonard W. Barrett Manufacturing of printed circuit boards or chip-packaging substrates involves the use of resin-filled reinforcement materials, known as prepregs, to bond together laminates with patterned copper layers and serve as dielectric...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011005.
Published Online: January 31, 2008
...Dezhi Li; Changqing Liu; Paul P. Conway The reliability of fine pitch Sn–3.8Ag–0.7Cu flip chip solder joints with three different pads, i.e., bare pads, pads with solder masks, and pads with microvia, on printed circuit boards (PCBs) was studied through thermal cycling. After assembly, ( Au , Ni...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
Published Online: January 31, 2008
...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 434–439.
Published Online: May 2, 2007
...Hiroyuki Tsuritani; Toshihiko Sayama; Kentaro Uesugi; Takeshi Takayanagi; Takao Mori In high-density packaging technology, one of the most important issues is the reliability of the microjoints connecting large scale integrated circuit chips to printed circuit boards electrically and mechanically...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 373–381.
Published Online: March 25, 2007
... to identification of the final configuration. Simulation models capable of predicting transient dynamics can provide valuable insight into the design reliability under shock environments. In this study, explicit finite-element models have been used to study the transient dynamics of printed circuit boards during...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 266–272.
Published Online: March 15, 2007
...Fang Liu; Guang Meng; Mei Zhao Dynamic properties of printed circuit board (PCB) assembly under drop impact are investigated when viscoelasticity of substrate materials is considered. The main materials of a PCB substrate are macromolecule resins, which are typical viscoelastic materials. From...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
... necessitate the fundamental understanding of damage mechanisms, which will be active in these environments. Electronics typical of office benign environments uses FR-4 printed circuit boards (PCBs). Automotive applications typically use high glass-transition temperature laminates such as FR4-06 glass∕epoxy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
... and temperature independent, and dependent material properties were incorporated in the finite element model (see Table 4 ). The symmetry boundary condition exists in the inner x and y directional plane. In all analyses presented in this study, the printed circuit...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2007, 129(2): 129–143.
Published Online: July 23, 2006
...Vipin Yadav; Keshav Kant Printed circuit boards (PCBs) with uniform surface temperature and uniform wall heat flux are ideal to study. However, in reality, the heating conditions existing on the PCB surfaces are much different from the ideal ones. Present attempts have been made to study different...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 353–359.
Published Online: February 20, 2006
..., fluidic channel dimension, and cooling location optimizations have been investigated. 12 05 2005 20 02 2006 printed circuits cooling thermal management (packaging) jets microfluidics flow Advanced cooling techniques are required for highly integrated microsystems ( 1...