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Keywords: probability density function
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Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011001.
Paper No: EP-19-1028
https://doi.org/10.1115/1.4043704
Published Online: August 1, 2019
... N ) is the joint probability density function of input variables. The m th-order statistical moment of the PDF is defined as (1) E { [ f ( y ) ] m } ≡ ∫ − ∞ + ∞ ⋯ ∫ − ∞ + ∞ { y ( x 1 , … , x N...
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development
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Topics: Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing
Journal Articles

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011002.
Paper No: EP-19-1029
https://doi.org/10.1115/1.4044218
Published Online: August 1, 2019
... . Manuscript received March 4, 2019; final manuscript received June 20, 2019; published online August 1, 2019. Assoc. Editor: Kaushik Mysore. 04 03 2019 20 06 2019 stacking yield model package-on-package approximate integration-based scheme probability density function warpage...
View Article titled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model
Open the PDF for Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model in another window
Topics: Corners (Structural elements), Density, Package on package, Probability, Solders, Uncertainty, Warping, Manufacturing, Solder joints