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Keywords: process modeling
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011004.
Paper No: EP-19-1023
Published Online: September 19, 2019
... of warpage orientation: ( a ) warpage evolution and ( b ) warpage orientation The calculated warpage of the reconstituted molded wafer during the fan-out fabrication process is displayed in Fig. 10( a ) . In the figure, “elastic” denotes the process modeling without considering the effects...
