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Keywords: protruding electronic component
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021011.
Published Online: April 3, 2009
... in the microcavities, as illustrated in Figs. 5 6 . The heat transfer occurs essentially by conduction in these locations, which provokes an overheating of these faces in comparison to the others. This trend is only observed for protruding electronic components and was absent for the case in which the chips...
