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Keywords: refrigeration
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... microfluidics micromechanical devices Peltier effect refrigeration refrigerators semiconductor device models semiconductor devices semiconductor materials semiconductor thin films thermoelectric devices thin film devices Thermoelectric cooling is used for temperature stabilization and control...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024501.
Published Online: March 27, 2009
...Cheng-Wei Tien; Kun-Huang Yu; Wen-Junn Sheu; Chi-Chuan Wang This study examines the refrigerant distribution of a dual cold-plate system subject to the influence of heating load, using a R-134a based vapor compression system with a nominal capacity ranging from 50 W to 250 W. The cold plate...
Journal Articles
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
Published Online: November 13, 2008
...Victor Chiriac; Florea Chiriac Classical refrigeration using vapor compression has been widely applied over the past decades to large-scale industrial systems, with few known applications to the microelectronic cooling field, due to the small size limitation. The present study proposes an efficient...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 291–299.
Published Online: March 28, 2007
... and thermohydraulic performance evaluation of high heat flux evaporators suitable for interfacing the microprocessor chip with a cascaded R134a∕R508b vapor compression refrigeration system at − 80 ° C . Four compact evaporator designs are examined—a base line slit-flow structure with no microfeatures, straight...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 30–37.
Published Online: June 17, 2005
... as an evaporator in an R134a refrigeration loop. This system is capable of maintaining device temperatures below 55 ° C while dissipating in excess of 100 W ∕ cm 2 . It is shown that while higher heat transfer coefficients are possible with greater mass velocities, those conditions are typically associated...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
Published Online: January 24, 2005
.... The current research focuses on mainframes (computer system), which uses a conventional refrigeration system to maintain chip temperatures below that of comparable air-cooled systems, but well above cryogenic temperatures. Multivariable control of compressor speed along with thermostatic expansion valve (TXV...