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Keywords: residual stress
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... (residual) stresses. The objective of our project is to evaluate the effects of stress on semiconductor devices. In this study, the shift of the DC characteristics of nMOSFETs during the resin-molding process was investigated experimentally. After a silicon chip including the n-type metal oxide...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 47–51.
Published Online: March 21, 2005
...Man-Lung Sham; Jang-Kyo Kim Polymeric encapsulant is widely used to protect the integrated circuit chips and thus to enhance the reliability of electronic packages. Residual stresses are introduced in the plastic package when the polymer is cooled from the curing temperature to ambient, from which...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 260–265.
Published Online: July 26, 2002
... energy barriers. There is also a stress threshold, introduced by the authors and representing an asymptotic residual stress below which relaxation does not occur. The model comprises three parameters: an activation volume, V; a product of several parameters with physical meaning, A (only the combination...