Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Format
Article Type
Subject Area
Topics
Date
Availability
1-4 of 4
Keywords: semiconductor device models
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
... finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors integrated circuit (IC) silicon chip hot spot thermal modeling multilevel modeling...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... semiconductor device models semiconductor devices semiconductor materials semiconductor thin films thermoelectric devices thin film devices Thermoelectric cooling is used for temperature stabilization and control of small area devices. Compared with the traditional heat pumps, thermoelectric...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... different from the experimental results. Several needed improvements to the electron-mobility model are proposed in this article. 06 04 2009 26 09 2009 04 03 2010 04 03 2010 conduction bands electron mobility internal stresses MOSFET moulding semiconductor device models...
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044501.
Published Online: October 21, 2009
... 2008 17 09 2009 21 10 2009 cooling finite element analysis heterojunction bipolar transistors microwave power amplifiers power bipolar transistors semiconductor device models temperature distribution collector-up (C-up) finite-element model (FEM) heterojunction bipolar...