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Keywords: semiconductor device packaging
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041015.
Published Online: December 23, 2011
.... 14 09 2010 23 08 2011 23 12 2011 23 12 2011 elemental semiconductors finite element analysis microprocessor chips semiconductor device models semiconductor device packaging silicon temperature distribution thermal analysis thermal management (packaging) transistors...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011006.
Published Online: March 9, 2011
... computational fluid dynamics cooling light emitting diodes optimisation printed circuits semiconductor device packaging thermal management (packaging) light-emitting diode printed circuit board LED array thermal modeling Light-emitting diodes (LEDs) demonstrate a number of benefits...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2011, 133(1): 014501.
Published Online: March 9, 2011
.... 29 05 2010 03 12 2010 09 03 2011 09 03 2011 cooling gallium arsenide gallium compounds genetic algorithms heterojunction bipolar transistors III-V semiconductors indium compounds semiconductor device packaging thermal management (packaging) thermal resistance thermal...
Journal Articles
Article Type: Book Reviews
J. Electron. Packag. March 2010, 132(1): 016501.
Published Online: March 19, 2010
... circuit reliability integrated circuit testing life testing printed circuit design printed circuit testing semiconductor device packaging semiconductor device reliability This book entitled “ Mechanical Design of Electronic Systems ” is written from a mechanical design perspective to introduce...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011003.
Published Online: March 4, 2010
... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031009.
Published Online: July 14, 2009
... ) . The base will also not have a benefit when the size of the chip approaches that of the copper block ( A ∗ = 1 ) . 16 10 2008 03 04 2009 14 07 2009 cooling finite element analysis heat pipes heat sinks semiconductor device packaging heat transfer heat flux centrifugal fan...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. June 2009, 131(2): 025001.
Published Online: April 1, 2009
... biological organs cancer cooling dosimetry flow simulation laser applications in medicine photodynamic therapy semiconductor device packaging semiconductor lasers thermal management (packaging) tumours Esophageal cancer is a significant cause of cancer-related deaths in the United States...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
Published Online: February 12, 2009
... provides specific information about the thermal path being influenced by the chimney. 25 04 2008 01 07 2008 12 02 2009 cooling natural convection semiconductor device packaging thermal conductivity thermal management (packaging) thermal resistance transistors The use...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. June 2008, 130(2): 024502.
Published Online: May 14, 2008
.... , and Salom , C. , 2000 , Polymer Viscoelasticity: Stress and Strain in Practice , Dekker , New York . ANSYS 10.0 Element Reference, Sec. 4. 03 06 2007 02 10 2007 14 05 2008 finite element analysis heat transfer moisture semiconductor device packaging stress analysis...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 102–108.
Published Online: December 14, 2006
... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis The technological revolution that started with the introduction of the transistor just over half a century ago is without parallel in the way it has shaped our economy and our daily lives. The current trend...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 208–214.
Published Online: August 26, 2005
... significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis. 03 01 2005 26 08 2005 semiconductor device packaging...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
Published Online: August 15, 2005
... their implications on the design of the system. 13 06 2005 15 08 2005 power MOSFET modules semiconductor device packaging cryogenic electronics cooling Recently, extensive research has been focused on the development of cryogenic power electronics system. Because certain semiconductor...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 25–28.
Published Online: March 21, 2005
... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
...% over the entire temperature and power ranges. Manuscript received April 23, 2004; revision received June 22, 2004. Review conducted by B. Sammakia. 23 April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat...
Journal Articles
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
Published Online: January 24, 2005
... management (packaging) semiconductor device packaging product development quality management reliability safety electronics industry Thermal Characterization Compact Modeling Dynamic Measurements Test Dies Reliability Many roadmaps recognize thermal management as one of the major...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 308–316.
Published Online: October 6, 2004
... alloys tin alloys lead alloys indium alloys heat sinks thermal management (packaging) thermal conductivity thermal analysis thermal energy storage temperature distribution solidification melting semiconductor device packaging power semiconductor devices Phase change thermal energy...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 135–141.
Published Online: April 30, 2004
... solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses Solder joint integrity is recognized as a key issue in the reliability of Flip Chip (FC) and Ball Grid Array (BGA) Integrated Circuit (IC) Packages. In a flip chip package...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 313–318.
Published Online: September 17, 2003
... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 261–267.
Published Online: June 10, 2003
... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion integrated circuit...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 419–426.
Published Online: December 12, 2002
... device packaging heat transfer natural convection temperature measurement simulation transients Advances in the packaging of portable electronic devices (cellular phones, laptop computers, etc.) reduce their size per consumer demand; consequently, the external surface area available for heat...