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Keywords: sequential build-up process
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 260–265.
Published Online: October 27, 2006
... 27 10 2006 adhesive bonding flip-chip devices integrated circuit reliability flip chip anisotropic conductive adhesive FR-4 sequential build-up process reliability The primary drivers in the electronics industry can be summarized as higher frequency, lower cost, more...
