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Keywords: shock load
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041010.
Paper No: EP-13-1102
Published Online: September 19, 2014
.... Shock attenuation performance of different potting materials and designs for the PCB assembly were evaluated using the drop impact simulations. A novel bilayer potting shock attenuation design was developed to effectively protect the PCB from shock loads resulting from impact drop test. The following...
