...Tohru Suwa; Hamid Hadim Although thermal performance is always a critical issue in electronic packaging design at every packaging level, there is a significant lack of reliable and efficient thermal modeling and analysis techniques at the silicon chip level. Sharp temperature increases within small...

... silicon chip alumina substrate adhesive bonding alumina ductility elemental semiconductors gold integrated circuit bonding scanning electron microscopy silicon thermal expansion 22 10 2010 26 02 2011 22 06 2011 22 06 2011 2011 American Society of Mechanical...