... ball grid arrays copper alloys lead alloys printed circuits reflow soldering reliability silver alloys solders thermal stress cracking tin alloys backward compatible mixed solder lead-free thermal cycling A large number of high reliability microelectronics applications...

... testing silver alloys solders tin alloys lead-free solder low-cycle fatigue strain rate effect creep strain stress relaxation cyclic loading Solder joints are subjected to cyclic inelastic deformation due to electronic parts having different coefficients of thermal expansion. Since...

... constitutive model time-independent strain time-dependent strain cyclic plasticity stress relaxation compressive strength copper alloys creep elastoplasticity electronics packaging fatigue mechanical testing silver alloys solders tensile strength tin alloys 09 12 2009 14 09...

.../base metal interface. The solder reacts with a small amount of the base metal and wets the metal by intermetallic compound formation ( 1 2 3 ). wetting solders contact angle surface roughness activation energy eutectic alloys interface phenomena lead alloys silver alloys solders...

... 27 03 2009 copper copper alloys electromigration failure analysis flip-chip devices gold alloys metallisation nickel alloys silver alloys solders substrates tin alloys electromigration reliability flip-chip solder joint substrate pad metallization An earlier...

... Materials , Cambridge University Press , Cambridge, UK , p. 106 . 09 05 2008 26 11 2008 27 03 2009 copper alloys creep deformation elastoplasticity silver alloys solders stress-strain relations tensile testing tin alloys viscoplasticity lead-free solder alloy...

... microscopy shear strength silver alloys solders tin alloys voids (solid) X-ray chemical analysis 29 04 2007 19 02 2008 18 02 2009 2009 American Society of Mechanical Engineers ...

... integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both consumer and military products are making greater use of electronics to enhance performance, and thus the use of electronics is continuously increasing...

... 2007 17 04 2008 11 02 2009 annealing copper alloys grain boundary diffusion hardness hardness testing high-temperature effects silver alloys solders thermal diffusion tin alloys thermomigration lead-free hardness elastic modulus grain coarsening...

... silver alloys solders tin alloys titanium vanadium 01 08 2007 07 01 2008 13 11 2008 2008 American Society of Mechanical Engineers ...

... impeded by a bigger one. 04 06 2007 03 12 2007 01 08 2008 chemical interdiffusion copper copper alloys current density dissolving electromigration finite element analysis flip-chip devices integrated circuit packaging silver alloys soldering solders tin alloys voids...

... 2008 29 07 2008 creep crystal microstructure silver alloys solders tin alloys constitutive model creep SnAg lead-free solder Lead-free solders such as SnAg and SnAgCu are used extensively as replacements of SnPb solders in microelectronics packaging. It has been found...

... integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal of study. The reason for this is easily understood on examining...

...) materials. reliability flip chip thermal cycling micro-via copper alloys flip-chip devices printed circuits silver alloys solders tin alloys 05 01 2007 12 07 2007 31 01 2008 2008 American Society of Mechanical Engineers ...

... and the opportunity to improve solder joint reliability. copper alloys creep fatigue finite element analysis plasticity silver alloys stress-strain relations tin alloys 27 09 2006 06 07 2007 31 01 2008 All current numerical implementations of the UCPD constitutive model use...

... 2006 19 07 2007 31 01 2008 copper alloys creep fatigue cracks finite element analysis plasticity silver alloys solders tin alloys fatigue prediction lead-free solder electronic packaging Environmental legislation and reliability concerns have motivated...

... for VQFN with Sn–Ag–Cu solder joint under cyclic bending load at both 25°C and 125°C. 23 01 2007 27 08 2007 bending strength copper alloys electronics packaging fatigue testing finite element analysis silver alloys soldering solders stress-strain relations surface finishing tin...

... eutectic alloys stress effects shear deformation creep testing tin alloys silver alloys copper alloys lead alloys fractography 14 03 2006 23 06 2006 2007 American Society of Mechanical Engineers ...

...-containing solder alloys. solders electronics packaging creep testing deformation tin alloys lead alloys silver alloys copper alloys 06 12 2005 21 05 2006 2007 American Society of Mechanical Engineers ...

... interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density 01 11 2005 19 05 2006 2007 American Society of Mechanical Engineers ...