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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2006, 128(3): 291–293.
Published Online: August 27, 2005
... , 114 ( 3 ), pp. 336 – 341 . 30 08 2004 27 08 2005 solders electronics packaging modeling solder joint shape solder joint with a stud Surface energy minimization theory for predicting molten solder droplet shape is well established at the present time (see...