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Keywords: solder voids
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021013.
Paper No: EP-13-1015
Published Online: June 1, 2015
..., 2015; published online January 30, 2015. Assoc. Editor: Paul Conway. 26 02 2013 07 01 2015 30 01 2015 Solder voids are detrimental to the thermal, mechanical, and reliability performance of integrated circuit (IC) packages and must be controlled within certain specifications...
